Weaker bonding can give larger thermal conductance at highly mismatched interfaces

Journal:
Science Advances
Published:
DOI:
10.1126/sciadv.abf8197
Affiliations:
2
Authors:
8
Institutions Authors Share
The University of Tokyo (UTokyo), Japan
6.000000
0.75
City University of Hong Kong (CityU), China
2.000000
0.25