Heterogeneous integration of rigid, soft, and liquid materials for self-healable, recyclable, and reconfigurable wearable electronics

Journal: Science Advances

Published: 2020-11-01

DOI: 10.1126/sciadv.abd0202

Affiliations: 4

Authors: 6

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Institutions Share
University of Colorado Boulder (CU-Boulder), United States of America (USA) 0.83
Tongji University, China 0.08
Beihang University (BUAA), China 0.08

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