Heterogeneous integration of rigid, soft, and liquid materials for self-healable, recyclable, and reconfigurable wearable electronics

Journal:
Science Advances
Published:
DOI:
10.1126/sciadv.abd0202
Affiliations:
4
Authors:
6
Institutions Authors Share
University of Colorado Boulder (CU-Boulder), United States of America (USA)
5.000000
0.83
Tongji University, China
0.500000
0.08
Beihang University (BUAA), China
0.500000
0.08