Skin-integrated wireless haptic interfaces for virtual and augmented reality

Journal: Nature

Published: 2019-11-20

DOI: 10.1038/s41586-019-1687-0

Affiliations: 23

Authors: 34

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Institutions Share
Center for Bio-Integrated Electronics (CBIE), NU, United States of America (USA) 0.14
NeuroLux, Inc., United States of America (USA) 0.12
Department of Materials Science and Engineering, UIUC, United States of America (USA) 0.10
Frederick Seitz Materials Research Laboratory (FS-MRL), UIUC, United States of America (USA) 0.10
Department of Biomedical Engineering (BME), CityU, China 0.09
Psyonic, Inc., United States of America (USA) 0.09
Department of Materials Science and Engineering, NU, United States of America (USA) 0.04
Department of Mechanical Engineering, NU, United States of America (USA) 0.04
Department of Civil and Environmental Engineering, NU, United States of America (USA) 0.04
Department of Biomedical Engineering, Arizona, United States of America (USA) 0.03
School of Microelectronics, SDU, China 0.03
Center for Flexible Electronics Technology, Tsinghua, China 0.03
MOE Key Laboratory of Applied Mechanics (AML), Tsinghua, China 0.03
Wearifi Evanston, United States of America (USA) 0.03
Bristol Composites Institute (ACCIS), UoB, United Kingdom (UK) 0.03
Department of Aerospace Engineering, Penn State, United States of America (USA) 0.03
School of Materials Science and Engineering (MSE), Tsinghua, China 0.01
Department of Micro/Nano Electronics, SJTU, China 0.01
Department of Engineering Mechanics, DUT, China 0.01
Department of Biomedical Engineering, NU, United States of America (USA) 0
Department of Neurological Surgery, NU, United States of America (USA) 0
Department of Chemistry, NU, United States of America (USA) 0
McCormick School of Engineering, NU, United States of America (USA) 0

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