Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

Journal: Nature Communications

Published: 2021-02-10

DOI: 10.1038/s41467-021-21136-0

Affiliations: 5

Authors: 16

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Institutions Share
School of Electrical Engineering and Computer Science (EECS), KTH, Sweden 0.38
AMO GmbH, Germany 0.25
Bundeswehr University Munich (UniBwM), Germany 0.25
RWTH Aachen University (RWTH Aachen), Germany 0.09
Protemics GmbH, Germany 0.03