High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications

Journal: Nature Communications

Published: 2020-08-24

DOI: 10.1038/s41467-020-18005-7

Affiliations: 5

Authors: 9

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Institutions Share
Kyushu University, Japan 0.48
Nissan Chemical Corporation, Japan 0.44
The University of Aizu, Japan 0.04
Tokai University, Japan 0.04

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