Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

Journal: ACS Nano

Published: 2018-05-22

DOI: 10.1021/acsnano.8b00180

Affiliations: 20

Authors: 32

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Institutions FC
Frederick Seitz Materials Research Laboratory (FS-MRL), UIUC, United States of America (USA) 0.41
Center for Bio-Integrated Electronics (CBIE), NU, United States of America (USA) 0.13
Department of Mechanical Engineering, AJOU, South Korea 0.06
Department of Civil and Environmental Engineering, NU, United States of America (USA) 0.04
Department of Mechanical Engineering, NU, United States of America (USA) 0.04
Department of Materials Science and Engineering, NU, United States of America (USA) 0.04
Center for Mechanics and Materials, Tsinghua, China 0.03
MOE Key Laboratory of Applied Mechanics (AML), Tsinghua, China 0.03
School of Electrical Engineering and Computer Science, GIST, South Korea 0.03
Division of Materials Science and Engineering, HYU, South Korea 0.03
Institute for Molecular Engineering (IME), United States of America (USA) 0.03
Department of Electronics Convergence Engineering, Kwangwoon University, South Korea 0.03
Department of Robotic Engineering, DGIST, South Korea 0.03
Center for Flexible Electronics Technology, Tsinghua, China 0.02
Center for Implantable Devices (CID), Purdue University, United States of America (USA) 0.01
Weldon School of Biomedical Engineering (BME), Purdue University, United States of America (USA) 0.01
School of Mechanical Engineering, Purdue University, United States of America (USA) 0.01
Birck Nanotechnology Center (BNC), Purdue University, United States of America (USA) 0.01

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