Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry

Journal: Analytical Chemistry

Published: 2019-12-20

DOI: 10.1021/acs.analchem.9b04530

Affiliations: 4

Authors: 10

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Institutions Share
Space Research and Planetary Sciences, UniBE, Switzerland 0.50
Department of Chemistry and Biochemistry (DCB), UniBE, Switzerland 0.30
Sackler Laboratory for Astrophysics, STRW, Netherlands 0.10
IBM Research - Zurich, Switzerland 0.10

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