Elemental Characterization of Al Nanoparticles Buried under a Cu Thin Film: TOF-SIMS vs STEM/EDX

Journal: Analytical Chemistry

Published: 2020-08-18

DOI: 10.1021/acs.analchem.0c02361

Affiliations: 3

Authors: 6

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Institutions Share
Department of Advanced Materials and Surfaces, EMPA, Switzerland 0.83
CEA Laboratory of Electronics and Information Technology (LETI), France 0.08
Grenoble Alpes University (UGA), France 0.08

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