Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)

Journal: Advanced Functional Materials

Published: 2018-12-13

DOI: 10.1002/adfm.201806440

Affiliations: 4

Authors: 8

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Institutions FC
School of Engineering, Brown University, United States of America (USA) 0.56
Picosun Oy, Finland 0.25
Department of Electrical and Computer Engineering, UC San Diego, United States of America (USA) 0.13
School of Medicine, PNU, South Korea 0.06

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